EVG 560 |
|
|---|---|
| Model | |
| Type | |
| Equipment Characteristics | |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
125 mm, 150 mm |
| Wafer holder Device that holds the wafers during processing. |
metal chuck |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1000 µm |