STS advanced oxide etcher
|Model||MESC Multiplex ICP system|
|Batch sizes||100 mm: 1, 150 mm: 1, 50 mm: 4, 75 mm: 1|
List or range of wafer diameters the tool can accept
|50 mm, 75 mm, 100 mm, 150 mm|
Types of wafers this equipment can accept
|1-flat, 2-flat, no-flat, notched|
Device that holds the wafers during processing.
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
|Borofloat (Schott), fused silica, glass (Hoya), Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), silicon on insulator|