Range of wafer piece dimensions the equipment can accept
|10 .. 20 mm|
Geometry of wafer pieces the equipment can accept
|circular, irregular, other, rectangular, triangular shard|
Range of wafer piece thickness the equipment can accept
|100 .. 1000 µm|
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
|alumina, ceramic, Corning 1737, fused silica, gallium arsenide, glass (Hoya), glass-ceramic, indium phosphide, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon on insulator, silicon on sapphire|