Unaxis SLR730

Alternate Name Plasma Therm SLR730
Manufacturer Unaxis
Model SLR730
Type commercial
Equipment Characteristics
Batch sizes 100 mm: 3, 125 mm: 3, 50 mm: 3, 75 mm: 3
Wafer diameter(s)
List or range of wafer diameters the tool can accept
50 mm, 75 mm, 100 mm, 125 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, Borofloat (Schott), ceramic, Corning 1737, fused silica, glass-ceramic, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon on insulator, silicon on sapphire, titanium
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm