MicroAutomation dicing saw |
|
|---|---|
| Alternate Name | Dicing Saw |
| Manufacturer | MicroAutomation |
| Model | T1100 |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 1, 125 mm: 1, 50 mm: 1, 75 mm: 1 |
| MOS clean | no |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
75 mm, 100 mm, 125 mm, 150 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
| Wafer holder Device that holds the wafers during processing. |
stainless steel |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, polyethylene, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator, silicon on sapphire |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |