Wet bench |
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Model | |
Type | commercial |
Equipment Characteristics | |
Batch sizes | 100 mm: 1, 150 mm: 1, 200 mm: 1, 50 mm: 1, 75 mm: 1 |
Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular, circular |
Wafer diameter(s) List or range of wafer diameters the tool can accept |
75 mm, 100 mm, 150 mm |
Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
quartz (fused silica), silicon carbide, silicon on insulator, quartz (single crystal), sapphire, silicon, Pyrex (Corning 7740), gallium arsenide, indium phosphide |
Wafer thickness List or range of wafer thicknesses the tool can accept |
250 .. 800 µm |