Hotplate |
|
|---|---|
| Model | |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 1, 150 mm: 1, 50 mm: 1, 75 mm: 1 |
| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm, 150 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
fused silica, gallium arsenide, indium phosphide, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 800 µm |