Wafer bonder

Type custom
Equipment Characteristics
Batch sizes 100 mm: 2, 25 mm: 2, 50 mm: 2, 75 mm: 2
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
25 .. 100 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Borofloat (Schott), Pyrex (Corning 7740), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1000 µm