Model NLD-6000
Type commercial
Equipment Characteristics
Batch sizes 100 mm: 1, 150 mm: 1
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Borofloat (Schott), Corning 1737, fused silica, glass (Hoya), Pyrex (Corning 7740), quartz (single crystal), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1500 µm