GSI ultratech
Model Ultratech
Type commercial
Comments
  • Other substrate and device materials may be considered. Please inquire if interested in depositing on other materials.
  • Graphite carrier used for wafers smaller than 100mm diameter.
Equipment Characteristics
Batch sizes 100 mm: 1, 25 mm: 5, 50 mm: 1, 75 mm: 1
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
 25 mm, 50 mm, 75 mm, 100 mm
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon on insulator, quartz (fused silica), silicon, Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 1000 µm