AMST Molecular Vapor Deposition System

Type commercial
Equipment Characteristics
Batch sizes 10 .. 150 mm: 1
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
10 .. 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
fused silica, Borofloat (Schott), Pyrex (Corning 7740), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1000 µm