Oxford Plasmalab PECVD System

Type commercial
Equipment Characteristics
Batch sizes 150 mm: 1
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1000 µm