Hitachi 4700 FE |
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Model | 4700 |
Type | commercial |
Equipment Characteristics | |
Batch sizes | 50 .. 150 mm: 1 |
Piece dimension Range of wafer piece dimensions the equipment can accept |
2 .. 150 mm |
Piece geometry Geometry of wafer pieces the equipment can accept |
triangular shard, other, rectangular, irregular, circular |
Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 2000 µm |
Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 .. 150 mm |
Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 2000 µm |