Hitachi 4700 FE

Model 4700
Type commercial
Equipment Characteristics
Batch sizes 50 .. 150 mm: 1
Piece dimension
Range of wafer piece dimensions the equipment can accept
2 .. 150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
triangular shard, other, rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
200 .. 2000 µm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
50 .. 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 2000 µm