x-tek Revolution

Model revolution
Type commercial
Equipment Characteristics
Batch sizes 10 .. 550 mm: 1
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
10 .. 550 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer thickness
List or range of wafer thicknesses the tool can accept
50 .. 1000 µm