Karl Suss SB6
|Batch sizes||100 mm: 2, 150 mm: 2|
List or range of wafer diameters the tool can accept
|100 .. 150 mm|
Types of wafers this equipment can accept
|1-flat, 2-flat, no-flat|
Device that holds the wafers during processing.
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
|silicon, Corning 1737|
List or range of wafer thicknesses the tool can accept
|200 .. 1000 µm|