Unaxis CLC 200

Model CLC 200
Type commercial
Equipment Characteristics
Batch sizes 100 mm: 25
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, PZT
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 600 µm