Model 650 Hot-Filament Diamond Deposition System

Model Model 650
Type commercial
  • Large usable deposition area—350mm by 375mm (14 in. by 15 in. )
Equipment Characteristics
Batch sizes 100 mm: 9, 150 mm: 4, 200 mm: 1, 300 mm: 1
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 .. 300 nm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 2000 µm
[Thumbnail]diamond_cvd.jpg (91.3 KB, image/jpeg)
attached by ozgur (Mehmet Ozgur) on 2006-06-29 15:29