Dual Column FIB

Model Dualbeam 820
Type commercial
  • Note - insulating materials and or substrates may make imaging and cutting more complex.
Equipment Characteristics
Batch sizes 0 .. 150 inch: 1
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
0 .. 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass-ceramic, ceramic, silicon carbide, gallium arsenide, ZnSe, PET, nickel, other, titanium, silicon germanium, gallium phosphide, Zeonor, BK7, Corning Eagle 2000, silicon on insulator, polystyrene, quartz (single crystal), silicon, polycarbonate, lithium niobate, copper, polyethylene, ABS_plastic, polypropylene, sapphire, Pyrex (Corning 7740), germanium, lanthanum aluminate, silicon on sapphire, alumina, quartz (fused silica), PMMA, indium phosphide, Phosphate Glass, PEEK, PZT, Foturan (Schott), Borofloat (Schott), fused silica, niobium, Corning 7070 Glass, glass (Hoya), Corning 1737
Wafer thickness
List or range of wafer thicknesses the tool can accept
0 .. 800 µm