Custom PECVD

Type commercial
Equipment Characteristics
Batch sizes 100 mm: 8, 125 mm: 4, 150 mm: 4, 200 mm: 2, 300 mm: 1, 50 mm: 8
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
25 .. 300 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
fused silica, Borofloat (Schott), indium phosphide, silicon, gallium arsenide, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 2000 µm