Custom Plating cell Model 1 |
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|---|---|
| Model | |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 .. 200 mm: 1 |
| MOS clean | no |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm, 125 mm, 150 mm, 200 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Pyrex (Corning 7740), silicon on insulator, silicon, ceramic, gallium arsenide, fused silica, Borofloat (Schott), glass-ceramic |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
| Attachments | |
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