Custom Plating cell Model 1

Type commercial
Equipment Characteristics
Batch sizes 100 .. 200 mm: 1
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm, 125 mm, 150 mm, 200 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Pyrex (Corning 7740), silicon on insulator, silicon, ceramic, gallium arsenide, fused silica, Borofloat (Schott), glass-ceramic
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
[Thumbnail]plating_cell.png (366.5 KB, image/png)
attached by ozgur (Mehmet Ozgur) on 2008-04-07 17:35