Disco Die Saw |
|
|---|---|
| Model | 3240 |
| Type | commercial |
| Equipment Characteristics | |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Borofloat (Schott), fused silica, silicon |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
50 .. 1000 µm |