Custom Heidelberg laser writer |
|
|---|---|
| Model | |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 10 .. 100 mm: 1 |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
10 .. 100 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
fused silica, gallium arsenide, silicon on insulator, silicon, Pyrex (Corning 7740) |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 5000 µm |
