Heidelberg VPG200++ |
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Model | VPG 200+ |
Type | commercial |
Equipment Characteristics | |
Batch sizes | 100 mm: 1, 150 mm: 1, 200 mm: 1 |
File formats List of CAD file formats supported (eg. GDSII, CIF) |
cif |
Mask plate dimensions Width, length, thickness of the mask plates (eg. 5x7x0.09 inch). |
200mm x 200mm |
Max field size | 200 mm |
Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm, 150 mm, 200 mm |
Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 2000 µm |