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About MEMS
Ion beam lithography: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Contact mask lithography
Maskless lithography
Miscellaneous lithography
Projection mask lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
on front
Ion beam lithography
Process characteristics:
Min feature size
Dimension of smallest feature to be resolved in the lithography.
Min feature size
Å
µm
nm
Dimension of smallest feature to be resolved in the lithography.
unconstrained
Sides processed
either
Equipment