Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  HCl bath (Potassium clean)
Material concentrations HCl/hydrogen peroxide/water [1:1:5]
Sides processed both
Wafer size
Wafer size
Equipment Silicide wet bench
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
 teflon chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, glass (category), quartz (single crystal), sapphire, silicon on insulator, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 550 µm
Comments:
  • Removes potassium ions from wafers.
  • Safe on non-metalized wafers.