Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Contact front-front alignment (MJB3)
Alignment side front
Field geometry
Shape of field with dimensions characterized by the maximum field size
 circle
Max field size 75 mm
Min feature size 2 µm
Sides processed either
Wafer size
Wafer size
Equipment Karl Suss MJB3 Mask Aligner
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
 vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 100 .. 500 µm
Comments: