Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Mechanical polishing
Process characteristics:
Materials
Specify material(s) to polish.
Materials
Available  
Selected
Specify material(s) to polish.
Roughness
Required RMS roughness of the polished surface (if known).
Roughness
Required RMS roughness of the polished surface (if known).
unconstrained
Thickness removed
Thickness of material to be removed.
Thickness removed
Thickness of material to be removed.
unconstrained
Sides processed either
Equipment
Comments:
  • The substrate is held on a rotating pad and pressed against a second large rotating grindstone. For the grinding, slurry containing small very hard particles (diamond or boron oxide) is used. The size of the particles used and other parameters, such as rotation speed and contact force, determines the removal rate and eventual roughness of the substrate (small particles = low removal rate = smooth surface). Surface roughness down to optical finish can be routinely achieved.