Process Hierarchy

on front
  Photoresist develop (Shipley 3612)
Batch size 1
Agent that reacts with masking layer (e.g., photoresist) to etch it selectively.
Material Shipley 3612
Process duration 4 min
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
Shipley 3612: 1
Sides processed either
Temperature 110 °C
Wafer size
Wafer size
Equipment SVG developer
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category), quartz (single crystal), silicon on sapphire, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 700 µm