Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Ball bonding
Process characteristics:
1st bonded material
Specify bond pad material for first end of bond wire.
1st bonded material
Specify bond pad material for first end of bond wire.
2nd bonded material
Specify bond pad material for second end of bond wire.
2nd bonded material
Specify bond pad material for second end of bond wire.
Ambient
Preferred environment for wire bonding (if known).
Ambient
Available  
Selected
Preferred environment for wire bonding (if known).
Bond strength
Required strength of wire bond (if known).
Bond strength
Required strength of wire bond (if known).
unconstrained
Min bond pad size
Minimum characteristic dimension of bond pad.
Min bond pad size
Minimum characteristic dimension of bond pad.
unconstrained
Min bond pad spacing
Minimum spacing between bond pads.
Min bond pad spacing
Minimum spacing between bond pads.
unconstrained
Number of bond wires
Total number of wires to be bonded.
Number of bond wires
Total number of wires to be bonded.
unconstrained
Temperature
Preferred temperature for wire bonding (if known).
Temperature
Preferred temperature for wire bonding (if known).
unconstrained
Wire material
Wire material
Wire material
Wire material
Equipment