Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Contact front-front alignment & exposure
Alignment side front
Alignment tolerance
Registration of CAD data to features on wafer
 0.5 µm
Batch size 1
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
 line
Max field size 4 inch
Min feature size 1 µm
Process duration 11 min
Sides processed either
Wafer size
Wafer size
Equipment Karl Suss MA6 Contact Aligner
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 no-flat, 1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
 glass plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 gallium arsenide, glass (category), quartz (single crystal), silicon, silicon on insulator, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 4000 µm
Comments:
  • Contact 1:1 aligner.
  • Two mask holder sizes are available: 4" and 5".
  • Contact programs are vacuum contact, hard contact, soft contact and low vacuum contact.
  • 1 um resolution is available only in the vacuum contact mode.
  • A higher resolution such as 0.75 um can be achieved by using a special type of photoresist.
  • See http://www.mems-exchange.org/users/litho-templates for information about layout requirements.