Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  4X E-beam XLS reticle mask
Batch size 1
Critical dimension tolerance 0.1 µm
Defect density
Density (by area) of defects of a given size (e.g., 1dpsi@1.0um).
 1dpsi@1.5um (MI)
Magnification 4
Mask coating
Mask coating material (eg. chrome).
 chromium
Mask material quartz (fused silica)
Mask plate dimension 5x5x0.09"
Min feature size 1 µm
Equipment
Comments:
  • CD tolerance on <2um CD is 0.1um.
  • Price includes 90 min of
    writing time. Excess writing
    time will be charged at $15
    per min, not to exceed 1X base price.