on front Stylus profilometer step measurement Down |
|
| Batch size |
1 |
|---|
| Contact force Force applied at contact point |
5 mN |
|---|
| Depth |
160 µm |
|---|
| Measurement aspect |
thickness |
|---|
| Measurement unit |
nm |
|---|
| Setup time |
30 min |
|---|
| Sides inspected The sides of the wafer inspected by the process |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Tencor Alphastep 200 Unavailable |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
plastic chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |
|---|
| Comments: |
|
