on front Contact front-front align & expose |
|
Alignment side |
front |
Alignment tolerance Registration of CAD data to features on wafer |
1 µm |
Batch size |
1 |
Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
Field geometry Shape of field with dimensions characterized by the maximum field size |
circle |
Max field size |
100 mm |
Min feature size |
1 µm |
Sides processed |
either |
Wafer size |
|
Equipment |
EV420 mask aligner |
Equipment characteristics: |
Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), silicon |
Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
Comments: |
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