Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  4X E-beam reticle mask (Micrascan3)
Process characteristics:
Beam spot diameter
Area of the beam used to write the mask
Beam spot diameter*
Area of the beam used to write the mask
Pellicle
If required add a pellicle here.
Pellicle*
yes no
If required add a pellicle here.
Batch size 1
Critical dimension tolerance 0.25 µm
Defect density
Density (by area) of defects of a given size (e.g., 1dpsi@1.0um).
 0dpsi@1um (automatic)
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
 line
Magnification 4
Mask coating
Mask coating material (eg. chrome).
 chromium
Mask material quartz (fused silica)
Mask plate dimension 6x6x0.25"
Min feature size 1 µm
Equipment
Comments:
  • if required, non-DUV pellicle (?) part # ASM149*113*4.6-DUV-A-V for consideration