|
| Process characteristics: |
| Depth |
|
|---|
| Batch size |
1 |
|---|
| Etchant Solutions and their concentrations. |
acetone |
|---|
| Material |
photoresist (category) |
|---|
| Sides processed |
both |
|---|
| Temperature |
25 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Solvent wet bench |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
teflon carrier |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
|---|
