|
| Batch size |
50 |
|---|
| Excluded materials |
gold (category), copper |
|---|
| Process duration |
0.5 min |
|---|
| Sides processed |
both |
|---|
| Temperature |
20 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
RCA hood |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
teflon chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
| Extra terms |
Customer agrees that wafers, masks, and other materials
incorporating any process(es) provided by this fabrication site
are to be used solely for non-commercial research
purposes.
|
