Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  CMP
Process characteristics:
Materials
Specify material(s) to polish.
Materials
Available  
Selected
Specify material(s) to polish.
Roughness
Required RMS roughness of the polished surface (if known).
Roughness
Required RMS roughness of the polished surface (if known).
unconstrained
Thickness removed
Thickness of material to be removed.
Thickness removed
Thickness of material to be removed.
unconstrained
Sides processed either
Equipment
Comments:
  • Chemical-mechanical polishing (CMP) is essentially mechanical polishing in which the slurry used is also an etchant for the surface to be polished. A system similar to mechanical polishing is used with some addition to contain the reactive slurry used. This type of polishing can be used to remove very small amounts of material with good precision.