Process Hierarchy

  Photoresist strip (metal)
Batch size 25
Solutions and their concentrations.
Material photoresist (category)
Process duration 20 min
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
photoresist (category): 1
Sides processed both
Temperature 50 °C
Wafer size
Wafer size
Equipment Metal wet bench
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat
Wafer holder
Device that holds the wafers during processing.
teflon cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category), quartz (single crystal), sapphire, silicon on insulator, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 700 µm
  • Doesn't etch silicon, silicon dioxide, quartz, aluminum, tungsten, TiW.