Process Hierarchy

on front
  Spectrophotometric film thickness measurement
Batch size 1
Excluded materials gold (category), copper
Materials silicon nitride on silicon, silicon dioxide on silicon, photoresist on silicon, phosphosilicate glass on silicon, borophosphosilicate glass on silicon, amorphous silicon on silicon, polyimide on silicon, photoresist on silicon dioxide, silicon nitride on silicon dioxide, photoresist on silicon nitride, polyimide on silicon nitride, amorphous silicon on silicon dioxide, platinum on silicon dioxide, SIMOX, silicon on insulator, polysilicon on silicon dioxide, photoresist on quartz, silicon nitride on quartz, polysilicon on quartz, indium tin oxide on quartz, amorphous silicon on quartz, platinum on quartz, nickel on quartz, Nichrome on quartz
Sides processed either
Thickness 20 .. 5000 nm
Wafer size
Wafer size
Equipment Nanometrics NanoSpec/AFT 4000
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
  • Each measurement consists of 5 measured locations on the wafer
Extra terms