on front Spectrophotometric film thickness measurement |
|
| Batch size |
1 |
|---|
| Excluded materials |
gold (category), copper |
|---|
| Materials |
silicon nitride on silicon, silicon dioxide on silicon, photoresist on silicon, phosphosilicate glass on silicon, borophosphosilicate glass on silicon, amorphous silicon on silicon, polyimide on silicon, photoresist on silicon dioxide, silicon nitride on silicon dioxide, photoresist on silicon nitride, polyimide on silicon nitride, amorphous silicon on silicon dioxide, platinum on silicon dioxide, SIMOX, silicon on insulator, polysilicon on silicon dioxide, photoresist on quartz, silicon nitride on quartz, polysilicon on quartz, indium tin oxide on quartz, amorphous silicon on quartz, platinum on quartz, nickel on quartz, Nichrome on quartz |
|---|
| Sides processed |
either |
|---|
| Thickness |
20 .. 5000 nm |
|---|
| Wafer size |
|
|---|
| Equipment |
Nanometrics NanoSpec/AFT 4000 |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
delrin |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
| Comments: |
|
| Extra terms |
Customer agrees that wafers, masks, and other materials
incorporating any process(es) provided by this fabrication site
are to be used solely for non-commercial research
purposes.
|
