Process Hierarchy

on front
  DUV Stepper front-front alignment
Alignment side front
Alignment tolerance
Registration of CAD data to features on wafer
0.07 µm
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Max field size 21 mm
Min feature size 0.35 µm
Setup time 30 min
Sides processed either
Wafer size
Wafer size
Equipment ASML 5500/90 DUV 4X stepper
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 700 µm
  • Wafer backside must be clean: no patterning, no resist. Uniform "hard" films are ok (oxide, nitride).