Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Laser-writing
Process characteristics:
Beam spot diameter
Area of the beam used to write the mask
Beam spot diameter
Area of the beam used to write the mask
unconstrained
Defect density
Density (by area) of defects of a given size (e.g., 1dpsi@1.0um) if known.
Defect density
Density (by area) of defects of a given size (e.g., 1dpsi@1.0um) if known.
Magnification
Magnification factor of layout file to image on mask.
Magnification
Magnification factor of layout file to image on mask.
unconstrained
Mask coating material
Select preferred mask coating material (if known).
Mask coating material
Select preferred mask coating material (if known).
Mask plate dimensions
Overall length/width/thickness of mask (ie. 5x5x0.09").
Mask plate dimensions
Overall length/width/thickness of mask (ie. 5x5x0.09").
Material
Select preferred mask material (if known).
Material
Select preferred mask material (if known).
Min feature size
Dimension of smallest feature to be realized on mask.
Min feature size
Dimension of smallest feature to be realized on mask.
unconstrained
Equipment