on front EDX material analysis |
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| Process characteristics: |
| Duration |
|
|---|
| Batch size |
1 |
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| Sides inspected The sides of the wafer inspected by the process |
either |
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| Wafer size |
|
|---|
| Equipment |
Hitachi S-4700 SEM |
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
0 .. 4 inch |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular, circular, triangular shard, irregular, other |
|---|
| Piece thickness Range of wafer piece thickness the equipment can accept |
100 .. 10000 µm |
|---|
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
|---|
| Wafer holder Device that holds the wafers during processing. |
aluminum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, germanium, glass (category), metal (category), Pyrex (Corning 7740), quartz (single crystal), sapphire, silicon, Borofloat (Schott), silicon dioxide, silicon germanium, silicon on insulator, silicon on sapphire |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 10000 µm |
|---|
| Comments: |
|
