Thick film printing with low-temperature inks |
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Process characteristics: |
Material Ink material used for printing. |
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Process duration Fab enters the estimated processing time. |
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Thickness |
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Batch size |
1 |
Excluded materials |
gold (category), copper |
Min feature size |
4 mil |
Temperature |
110 °C |
Wafer size |
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Equipment |
MPM TF-100
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Equipment characteristics: |
MOS clean |
no |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, glass (category), silicon |
Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 1000 µm |
Comments: |
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Extra terms |
Customer agrees that wafers, masks, and other materials
incorporating any process(es) provided by this fabrication site
are to be used solely for non-commercial research
purposes.
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