Process Hierarchy

  Thick film printing with low-temperature inks
Process characteristics:
Material
Ink material used for printing.
Material
Ink material used for printing.
Process duration
Fab enters the estimated processing time.
Process duration
Fab enters the estimated processing time., must be 1 .. 4 hour
1 .. 4 hour
Thickness
Thickness
must be 5 .. 15 µm
5 .. 15 µm
Batch size 1
Excluded materials gold (category), copper
Min feature size 4 mil
Temperature 110 °C
Wafer size
Wafer size
Equipment MPM TF-100
  • Can also print on macor, kapton, nylon, and teflon substrates.
Equipment characteristics:
MOS clean no
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, glass (category), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 1000 µm
Comments:
  • The masks must be supplied by customer. CWRU can make masks only if that require features larger than 400um.
Extra terms