Process Hierarchy

  Photoresist develop (SU-8)
Batch sizes 25 .. 200 mm: 4
Agent that reacts with masking layer (e.g., photoresist) to etch it selectively.
MicroChem SU-8 Developer
Material SU-8
Sides processed both
Temperature 60 °C
Wafer size
Wafer size
Equipment Wet Bench
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Pyrex (Corning 7740), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 3000 µm