Process Hierarchy

  Clean (metal)
Batch size 25
Etch rate 0 µm/min
Process duration 60 min
Sides processed both
Temperature 40 °C
Wafer size
Wafer size
Equipment Metal wet bench
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat
Wafer holder
Device that holds the wafers during processing.
teflon cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category), quartz (single crystal), sapphire, silicon on insulator, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 700 µm
  • Wet bench used depends on what materials are on wafer.
  • Wafers with Al, W, TiW on them should get this clean.
  • Add 30 minutes for wafers with resist or scribed.