Process Hierarchy

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  Contact sheet resistivity measurement
Batch size 1
Excluded materials gold (category), copper
Field geometry
Shape of field with dimensions characterized by the maximum field size
Max field size 145 mm
Sides processed either
Temperature 20 °C
Wafer size
Wafer size
Equipment Tencor RS35C
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
anodized aluminum
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon dioxide
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
Extra terms