Process Hierarchy

on front
  Spectroscopic ellipsometry film thickness measurement
Batch size 1
Excluded materials gold (category), copper
Materials silicon, polysilicon, silicon nitride, silicon dioxide
Sides processed either
Thickness 10 .. 2000 nm
Wafer size
Wafer size
Equipment Rudolph Research AutoEL
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
stainless steel
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
Extra terms