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| Ambient Ambient to which substrate is exposed during processing |
air |
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| Material |
AZ 5214e |
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| Temperature |
230 °C |
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| Thickness |
0.5 .. 2 µm |
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| Wafer size |
|
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| Equipment |
Fusion Photoresist UV Stabilizer |
| Equipment characteristics: |
| Batch sizes |
100 mm: 25, 150 mm: 25, 75 mm: 25 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
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| Wafer holder Device that holds the wafers during processing. |
cassette |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, quartz (fused silica), silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
250 .. 800 µm |
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